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                  QT-3108SW dynamic test solution

                  Low spurious 247/TPAK dynamic test solution: consists of QT-3108SW dynamic test system and gravity handler.
                  Supports dynamic parameter testing of TO247/TPAK SiC MOS IGBT packaged devices.

                  Multiple security protections
                    Support overload and undervoltage protection
                    RG 1-512 linearly adjustable
                    Load inductance 10-1100uH step 10uH
                    Short circuit protection<1us
                    Support KGD test pin card protection circuit
                  Testing Requirements, comprehensive coverage

                  QT-3108SW has complete functions and supports SW, ISC, TRR (series parameters),
                  ILATCH, SCSOA, QG parameter testing, optional UIS.

                  Application Environment

                  The test application board is directly connected to the handler

                  Turn-on/turn-off delay TDON/TDOFF

                  Measuring range: 0~2us
                  Stability: ±3%

                  Rise/fall time TR/TF

                  Measuring range: 0~2us
                  Stability: ±3%

                  Reverse recovery time TRR

                  Measuring range: 0~5us
                  Stability: ±3%

                  Reverse recovery charge QRR

                  Measuring range: 0~10uC;
                  Stability: ±3%

                  Total gate charge QG

                  Measuring range: 0~100uC;
                  Stability: ±3%

                  Short circuit current SCCOA

                  Measuring range: 0~5000 A;
                  Stability: ±3%

                  Clamp current ILATCH

                  Measuring range: 25~1000 A;
                  Stability: ±3%

                  Threshold voltage VTH

                  Measuring range: 0~10.0V;
                  Stability: ±3%



                  < 30nH
                  Stray inductance
                  Integrated testing,

                  To solve the problem of poor test results caused by wire distributed inductance.

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